Microstructural analysis of copper interconnections using picosecond ultrasonics
- James M.E. Harper
- Sandra G. Malhotra
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
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Nondestructive evaluation of interfaces in bonded silicon-on-insulator structures using the picosecond ultrasonics technique
- H.-Y. Hao
- H.J. Maris
- et al.
- 1998
- Electrochemical and Solid-State Letters