Effect of oxygen at the Cu-SiCxNy interface on electromigration performance of interconnect structures
- E. Liniger
- C. Dziobkowski
- 2006
- Thin Solid Films
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129 results for Eric G. Liniger
Effect of metal liner on electromigration in Cu Damascene lines
- C.-K. Hu
- L. Gignac
- et al.
- 2005
- Journal of Applied Physics
Simple model for time-dependent dielectric breakdown in inter- and intralevel low- k dielectrics
- J.R. Lloyd
- E. Liniger
- et al.
- 2005
- Journal of Applied Physics
Spatial Variations in the Sintering Rate of Ordered and Disordered Particle Structures
- Eric G. Liniger
- Rishi Raj
- 2005
- JACerS
Electromigration and adhesion
- James R. Lloyd
- Michael W. Lane
- et al.
- 2005
- IEEE T-DMR
Moisture-driven crack growth in blanket low dielectric constant and ultralow dielectric constant films
- E. Liniger
- E. Simonyi
- 2004
- Journal of Applied Physics
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
- C.-K. Hu
- L. Gignac
- et al.
- 2003
- Applied Physics Letters
Effect of liner thickness on electromigration lifetime
- E. Liniger
- C.-K. Hu
- et al.
- 2003
- Journal of Applied Physics
Relationship between interfacial adhesion and electromigration in Cu metallization
- M.W. Lane
- E. Liniger
- et al.
- 2003
- Journal of Applied Physics
Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters