UV cure impact on robust low-k with sub-nm pores and high carbon content for high performance Cu/low-k BEOL modules
- N. Inoue
- F. Ito
- et al.
- 2013
- IITC 2013
Publications
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129 results for Eric G. Liniger
Materials and scaling effects on on-chip interconnect reliability
- C.-K. Hu
- E. Liniger
- et al.
- 2013
- MRS Spring Meeting 2013
Electrolyte additive chemistry and feature size-dependent impurity incorporation for Cu interconnects
- James J. Kelly
- Takeshi Nogami
- et al.
- 2011
- ECS Meeting 2011
Cu CMP and its challenge for 20nm nodes and beyond
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2012
- MRS Spring Meeting 2012
The effect of voltage bias stress on temperature-dependent conduction properties of low-k dielectrics
- Joanna Atkin
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
Tailoring dielectric materials for robust BEOL reliability
- G. Bonilla
- T.M. Shaw
- et al.
- 2012
- IRPS 2012
Probing the interface barriers of dopant-segregated silicide-Si diodes with internal photoemission
- Zhen Zhang
- Joanna Atkin
- et al.
- 2012
- IEEE T-ED
Microstructure, impurity and metal cap effects on Cu electromigration
- C. K. Hu
- Lynne Gignac
- et al.
- 2012
- AIP-CP 2012
Synergistic combinations of dielectrics and metallization process technology to achieve 22 nm interconnect performance targets
- G.A. Antonelli
- G. Jiang
- et al.
- 2012
- Microelectronic Engineering
Processing and moisture effects on TDDB for Cu/ULK BEOL structures
- E. Liniger
- T.M. Shaw
- et al.
- 2012
- Microelectronic Engineering