Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
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119 results for Stephan A. Cohen
High reliability 32 nm Cu/ULK BEOL based on PVD CuMn seed, and its extendibility
- Takeshi Nogami
- Tibor Bolom
- et al.
- 2010
- IEDM 2010
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Advanced gate stacks with fully silicided (FUSI) gates and high-κ dielectrics: Enhanced performance at reduced gate leakage
- E. Gusev
- C. Cabral Jr.
- et al.
- 2004
- IEDM 2004
Characterization of thin dielectric films as copper diffusion barriers using triangular voltage sweep
- S. Cohen
- J.C. Liu
- et al.
- 1999
- MRS Spring Meeting 1999
Properties development during curing of low dielectric-constant spin-on glasses
- R.F. Cook
- E. Liniger
- et al.
- 1998
- MRS Spring Meeting 1998
Effects of wafer cleaning reduction on metals removal and ultrathin gate oxide quality
- C. D'Emic
- S. Cohen
- et al.
- 1997
- MRS Spring Meeting 1997
Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
Characterization of defects produced in TEOS thin films due to chemical-mechanical polishing (CMP)
- F.B. Kaufman
- S. Cohen
- et al.
- 1995
- MRS Spring Meeting 1995
High performance dielectrics and processes for ULSI interconnection technologies
- J. Paraszczak
- D. Edelstein
- et al.
- 1993
- IEDM 1993