A New Clustering-Function-Based Formulation of Temporal and Spatial Clustering Model Involving Area Scaling and its Application to Parameter Extraction
- Ernest Wu
- Brian McGowan
- et al.
- 2024
- IRPS 2024
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32 results for H. Huang
A Unified TDDB Model for BEOL Dielectrics of Various Structures and Thick FEOL Dielectrics
- Kenji Okada
- Kei Date
- et al.
- 2024
- IEEE Transactions on Electron Devices
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects
- Takeshi Nogami
- Oleg Gluschenkov
- et al.
- 2022
- VLSI Technology and Circuits 2022
Electromigration and Line R of Graphene Capped Cu Dual Damascene Interconnect
- T. Nogami
- S. Nguyen
- et al.
- 2021
- IEDM 2021
Selective deposition of AlOx for Fully Aligned Via in nano Cu interconnects
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2021
- IITC 2021
Dual Damascene BEOL Extendibility With Cu Reflow / Selective TaN And Co/Cu Composite
- P. Bhosale
- N. Lanzillo
- et al.
- 2021
- VLSI Technology 2021
In-situ preclean run path impact on selective cobalt cap deposition and electromigration
- Matthew Shoudy
- Hosadurga Shobha
- et al.
- 2020
- ASMC 2020
Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
Composite Interconnects for High-Performance Computing beyond the 7nm Node
- P. Bhosale
- S. Parikh
- et al.
- 2020
- VLSI Technology 2020
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters