Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- Torsten Reuschel
- Jan B. Preibisch
- et al.
- 2017
- IEEE Transactions on CPMT
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110 results for Young Kwark
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- Sebastian Müller
- Torsten Reuschel
- et al.
- 2015
- IEEE Trans Electromagn Compat
An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
- Jingwei Bai
- Deqiang Wang
- et al.
- 2014
- Nanoscale
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- Ki Jin Han
- Xiaoxiong Gu
- et al.
- 2014
- IEEE Transactions on CPMT
Using via stubs in periodic structures for microwave filter design
- Andreas Hardock
- Young H. Kwark
- et al.
- 2014
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2012
- IEEE Trans. Instrum. Meas.
A 24-channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single "holey" CMOS IC
- Clint L. Schow
- Fuad E. Doany
- et al.
- 2011
- Journal of Lightwave Technology
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- Alina Deutsch
- Roger S. Krabbenhoft
- et al.
- 2010
- IEEE Trans Electromagn Compat