Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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110 results for Young Kwark

Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- - Torsten Reuschel
  - Jan B. Preibisch
  - et al.
- 2017
- IEEE Transactions on CPMT
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- - Sebastian Müller
  - Torsten Reuschel
  - et al.
- 2015
- IEEE Trans Electromagn Compat
An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- - Yao-Jiang Zhang
  - Liehui Ren
  - et al.
- 2015
- IEEE T-MTT
Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
- - Jingwei Bai
  - Deqiang Wang
  - et al.
- 2014
- Nanoscale
Modeling on-board via stubs and traces in high-speed channels for achieving higher data bandwidth
- - Ki Jin Han
  - Xiaoxiong Gu
  - et al.
- 2014
- IEEE Transactions on CPMT
Using via stubs in periodic structures for microwave filter design
- - Andreas Hardock
  - Young H. Kwark
  - et al.
- 2014
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- - Sebastian Müller
  - Xiaomin Duan
  - et al.
- 2012
- IEEE Trans Electromagn Compat
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- - Miroslav Kotzev
  - Renato Rimolo-Donadio
  - et al.
- 2012
- IEEE Trans. Instrum. Meas.
A 24-channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single "holey" CMOS IC
- - Clint L. Schow
  - Fuad E. Doany
  - et al.
- 2011
- Journal of Lightwave Technology
Application of the short-pulse propagation technique for broadband characterization of PCB and other interconnect technologies
- - Alina Deutsch
  - Roger S. Krabbenhoft
  - et al.
- 2010
- IEEE Trans Electromagn Compat