32nm general purpose bulk CMOS technology for high performance applications at low voltage
- F. Arnaud
- J. Liu
- et al.
- 2008
- IEDM 2008
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23 results for James H.-C. Chen
22 nm technology compatible fully functional 0.1 μm 2 6T-sram cell
- B. Haran
- A. Kumar
- et al.
- 2008
- IEDM 2008
CMP Defect Reduction and Mitigation: Practices and Future Trends
- Wei-Tsu Tseng
- Carol Boye
- et al.
- 2021
- ASMC 2021
A Systematic Study on BEOL Defectivity Control for Future AI Application
- James H.-C. Chen
- Fee Li Lie
- et al.
- 2020
- ASMC 2020
Strategy of Insertion of Merge Features in a Sea of Wires SADP Integration
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2018
- IITC 2018
A Study on SADP Process Refresh for Patterning Correction
- James H.-C. Chen
- Isabel C Estrada-Raygoza
- et al.
- 2018
- IITC 2018
Future on-chip interconnect metallization and electromigration
- C. K. Hu
- James Kelly
- et al.
- 2018
- IRPS 2018
Electromigration and resistivity in on-chip Cu, Co and Ru damascene nanowires
- C. K. Hu
- James Kelly
- et al.
- 2017
- IITC 2017
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017
Segment removal strategy in SAQP for advanced BEOL application
- James H.-C. Chen
- Terry A. Spooner
- et al.
- 2017
- IITC 2017