Reactive ion etching lag investigation of oxide etching in fluorocarbon electron cyclotron resonance plasmasO. JoubertG.S. Oehrleinet al.1994Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Fluorocarbon high density plasma. VI. Reactive ion etching lag model for contact hole silicon dioxide etching in an electron cyclotron resonance plasmaM. Surendra1994Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films