Electromigration and stress reliability in multilevel interconnect metallizationPaul S. HoM.A. Moskeet al.1992SPIE Microelectronic Processing 1992
Stress behavior during thermal cycling in metal-polyimide layered filmsM.A. MoskeJ.E. Lewiset al.1991ANTEC Annual Technical Conference 1991
Measurement of thermal stress and stress relaxation in confined metal lines. I. Stresses during thermal cyclingM.A. MoskeP.S. Hoet al.1993Journal of Applied Physics
Measurement of thermal stress and stress relaxation in confined metal lines. II. Stress relaxation studyM.A. MoskeP.S. Hoet al.1993Journal of Applied Physics