Molecular Inverse-Design Platform for Material Industries
- Seiji Takeda
- Toshiyuki Hama
- et al.
- 2020
- KDD 2020
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68 results for Dan Sanders
DSA patterning options for logics and memory applications
- Chi Chun Liu
- Elliott Franke
- et al.
- 2017
- SPIE Advanced Lithography 2017
Electrical study of DSA shrink process and CD rectification effect at sub-60nm using EUV test vehicle
- Cheng Chi
- Chi Chun Liu
- et al.
- 2017
- SPIE Advanced Lithography 2017
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
Strategies to enable directed self-Assembly contact hole shrink for tight pitches
- Kristin Schmidt
- Hitoshi Osaki
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2016
- SPIE Advanced Lithography 2016
Contrast enhanced diffusion NMR: Quantifying impurities in block copolymers for DSA
- Rudy J. Wojtecki
- Ellie Porath
- et al.
- 2016
- SPIE Advanced Lithography 2016
Directed self-assembly of topcoat-free, integration-friendly high-χ block copolymers
- Eri Hirahara
- Margareta Paunescu
- et al.
- 2015
- SPIE Advanced Lithography 2015
Customization and design of directed self-assembly using hybrid prepatterns
- Joy Y. Cheng
- Gregory S. Doerk
- et al.
- 2015
- SPIE Advanced Lithography 2015