Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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78 results for John Knickerbocker

Micro-interconnection reliability: Thermal, electrical and mechanical stress
- - Steven L. Wright
  - Cornelia Tsang
  - et al.
- 2012
- ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- - Zheng Xu
  - Xiaoxiong Gu
  - et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- - John Knickerbocker
  - Paul Andry
  - et al.
- 2012
- ECTC 2012
Electromagnetic-SPICE modeling and analysis of 3D power network
- - Zheng Xu
  - Jian-Qiang Lu
  - et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Low-profile 3D silicon-on-silicon multi-chip assembly
- - Paul Andry
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
CMOS compatible thin wafer processing using temporary mechanical wafer, adhesive and laser release of thin chips/wafers for 3D integration
- - Bing Dang
  - Paul Andry
  - et al.
- 2010
- ECTC 2010
IMC bonding for 3D interconnection
- - Katsuyuki Sakuma
  - Kuniaki Sueoka
  - et al.
- 2010
- ECTC 2010
Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects
- - Fuad E. Doany
  - Benjamin G. Lee
  - et al.
- 2010
- ECTC 2010