Co-Packaged Optics (CPO) Technology Full Module Test Vehicle Demonstrations
- John U. Knickerbocker
- Jean Benoit Herou
- et al.
- 2025
- ECTC 2025
Publications
82 results for John Knickerbocker
Photonic Modules with High Density Polymer Waveguide Interface
- J.B. Heroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Photonic Modules with High Density Polymer Waveguide Interface
- J.B. Héroux
- A. Paz Ramos
- et al.
- 2025
- OFC 2025
Healthcare Wearable Sensors Adhesion to Human Fingernails and Toenails
- Katsuyuki Sakuma
- Leanna Pancoast
- et al.
- 2023
- Micromachines
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Voids-free Die-level Cu/ILD Hybrid bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2023
- ECTC 2023
Thermal solution for Co-Packaged Optics (CPO) modules
- Keiji Matsumoto
- Mukta Farooq
- et al.
- 2022
- EDAPS 2022
Surface Energy Characterization for Die-Level Cu Hybrid Bonding
- Katsuyuki Sakuma
- Roy Yu
- et al.
- 2022
- ECTC 2022
Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications
- Qianwen Chen
- Bing Dang
- et al.
- 2020
- ECTC 2020
Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing
- Gaddi Blumrosen
- Katsuyuki Sakuma
- et al.
- 2020
- IEEE Access