Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

Date

Start

End

Featured collections

Popular topics

78 results for John Knickerbocker

Novel adhesive development for CMOS-compatible thin wafer handling
- - K. Tamura
  - K. Nakada
  - et al.
- 2010
- ECTC 2010
Die-to-wafer 3D integration technology for high yield and throughput
- - Katsuyuki Sakuma
  - Paul S. Andry
  - et al.
- 2008
- MRS Fall Meeting 2008
3D silicon integration
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2008
- ECTC 2008
300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- - Bing Dang
  - Da-Yuan Shih
  - et al.
- 2008
- ECTC 2008
Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
3D chip stacking technology with low-volume lead-free interconnections
- - K. Sakuma
  - P. Andry
  - et al.
- 2007
- ECTC 2007
Assembly, characterization, and reworkability of Pb-free ultra-fine pitch C4s for system-on-package
- - B. Dang
  - S.L. Wright
  - et al.
- 2007
- ECTC 2007
CMOS-compatible through silicon vias for 3D process integration
- - Cornelia K. Tsang
  - Paul S. Andry
  - et al.
- 2006
- MRS Fall Meeting 2006
System-on-Package (SOP) technology, characterization and applications
- - J. Knickerbocker
  - P. Andry
  - et al.
- 2006
- ECTC 2006