NiFe-based Ball-limiting-metallurgy (BLM) for microbumps at 50μm pitch in 3D chip stacks
- Bing Dang
- Steven Wright
- et al.
- 2013
- ECTC 2013
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79 results for John Knickerbocker
Measurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Multiple voltage-supplies in TSV-based three-dimensional (3D) power distribution networks
- Zheng Xu
- Xiaoxiong Gu
- et al.
- 2012
- ECTC 2012
Micro-interconnection reliability: Thermal, electrical and mechanical stress
- Steven L. Wright
- Cornelia Tsang
- et al.
- 2012
- ECTC 2012
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits
Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011