Embedded two-phase cooling of large 3D compatible chips with radial channels
- Mark D. Schultz
- Fanghao Yang
- et al.
- 2015
- InterPACK 2015
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78 results for John Knickerbocker
Measurement of back end of line thermal resistance for 3D chip stacks
- E.G. Colgan
- R.J. Polastre
- et al.
- 2013
- SEMI-THERM 2013
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
24-channel optical transceiver module for waveguide-on-card interconnects
- Jeffrey A. Kash
- Clint L. Schow
- et al.
- 2010
- OFC/NFOEC 2010
24-Channel optical transceiver module for waveguide-on-card interconnects
- Jeffrey A. Kash
- Clint L. Schow
- et al.
- 2010
- OFC 2010
Reliable through silicon vias for 3D silicon applications
- M.J. Shapiro
- M. Interrante
- et al.
- 2009
- IITC 2009
Terabus: Chip-to-chip board-level optical data buses
- J.A. Kash
- F.E. Doany
- et al.
- 2008
- LEOS 2008
C4NP for Pb-free solder wafer bumping and 3D fine-pitch applications
- D.Y. Shih
- B. Dang
- et al.
- 2008
- ICEPT-HDP 2008