Publications

82 results for John Knickerbocker

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology
- - John U. Knickerbocker
  - Chirag S. Patel
  - et al.
- 2005
- CICC 2005
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- - John U. Knickerbocker
  - Paul S. Andry
  - et al.
- 2005
- IBM J. Res. Dev