Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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27 results for Kuniaki Sueoka

Characterization of stacked die using die-to-wafer integration for high yield and throughput
- - K. Sakuma
  - P. Andry
  - et al.
- 2008
- ECTC 2008
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- - Sayuri Kohara
  - Toyohiro Aoki
  - et al.
- 2022
- ITherm 2022
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- - Chinami Marushima
  - Toyohiro Aoki
  - et al.
- 2021
- ICEP 2021
Advanced interconnect technologies in the era of cognitive computing
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2016
- Pan Pacific 2016
Vertical integration after stacking (ViaS) process for low-cost and low-stress 3D silicon integration
- - Kuniaki Sueoka
  - Akihiro Horibe
  - et al.
- 2015
- 3DIC 2015
Nanomaterials for silicon photonic packaging spin-on nanomaterials for optical packaging
- - Yoichi Taira
  - Kuniaki Sueoka
  - et al.
- 2014
- ICEP 2014
Fine-pitch solder joining for high density interconnection
- - Kuniaki Sueoka
  - Sayuri Kohara
  - et al.
- 2014
- ICEP 2014
Thermo-mechanical evaluation of 3D packages
- - Sayuri Kohara
  - Akihiro Horibe
  - et al.
- 2013
- 3DIC 2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- - Keiji Matsumoto
  - Soichiro Ibaraki
  - et al.
- 2013
- 3DIC 2013
Scaling challenges of semiconductor packaging in the era of big data
- - Yasumitsu Orii
  - Akihiro Horibe
  - et al.
- 2013
- IMAPS 2013