CFD Simulation Analysis of Inter/Intra Chip Liquid Cooling for 3D Stacked ICs
- Risa Miyazawa
- Hiroyuki Mori
- et al.
- 2023
- iTHERM 2023
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24 results for Takashi Hisada
Flip Chip Joining with Injection Molded Solder Technology
- Takashi Hisada
- Toyohiro Aoki
- 2023
- EDTM 2023
Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
- Sayuri Kohara
- Toyohiro Aoki
- et al.
- 2022
- ITherm 2022
Thermal modeling of Direct Bonded Heterogenous Integration (DBHi) MCM package with Si microcooler
- Risa Miyazawa
- Takashi Hisada
- et al.
- 2022
- ITherm 2022
Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar
- Takashi Hisada
- Sayuri Kohara
- et al.
- 2022
- ICEP 2022
Fine pitch bumping and flip chip joining with Sn-BI based solders by injection molded solder technology
- Toyohiro Aoki
- Katsuhiro Yoshida
- et al.
- 2021
- ICEP 2021
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Circuits 2017
Implementation challenges for scalable neuromorphic computing
- Shintaro Yamamichi
- Akihiro Horibe
- et al.
- 2017
- VLSI Technology 2017
Flip chip joining with low temperature solders and thermal gradient bonding
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2017
- ICEP 2017