The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
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Applications of Topological Semimetals for Post-Cu Interconnects
- Ching-Tzu Chen
- Hsin Lin
- et al.
- 2024
- MRS Spring Meeting 2024
Exploring Topological Semimetals for Highly Scaled Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional Resistivity Scaling in Topological Semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- MRS Spring Meeting 2023
Unconventional resistivity scaling in topological semimetal CoSi
- Hsin Lin
- Shang-Wei Lien
- et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- Ching-Tzu Chen
- Christian Lavoie
- et al.
- 2023
- APS March Meeting 2023
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- Sushant Kumar
- Yi-Hsin Tu
- et al.
- 2022
- MRS Spring Meeting 2022
Surface initiated polymer thin films for the area selective deposition and etching of metal oxides
- Thomas G. Pattison
- Alexander E. Hess
- et al.
- 2020
- ACS Nano
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- Nicholas A. Lanzillo
- Kisik Choi
- et al.
- 2019
- IEEE Electron Device Letters
DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- Minhaz Abedin
- Shahrukh Khan
- et al.
- 2024
- ASMC 2024