Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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56 results for Nick Lanzillo

Unconventional Resistivity Scaling in Topological Semimetal CoSi
- - Hsin Lin
  - Shang-Wei Lien
  - et al.
- 2023
- MRS Spring Meeting 2023
Unconventional resistivity scaling in topological semimetal CoSi
- - Hsin Lin
  - Shang-Wei Lien
  - et al.
- 2023
- APS March Meeting 2023
Exploring Unconventional Resistivity Scaling in Topological Semimetals for Interconnects Beyond Copper
- - Ching-Tzu Chen
  - Christian Lavoie
  - et al.
- 2023
- APS March Meeting 2023
Evaluating the Potential of Weyl Semimetals as Future Interconnect Metals
- - Sushant Kumar
  - Yi-Hsin Tu
  - et al.
- 2022
- MRS Spring Meeting 2022
Surface initiated polymer thin films for the area selective deposition and etching of metal oxides
- - Thomas G. Pattison
  - Alexander E. Hess
  - et al.
- 2020
- ACS Nano
Exploring the Limits of Cobalt Liner Thickness in Advanced Copper Interconnects
- - Nicholas A. Lanzillo
  - Kisik Choi
  - et al.
- 2019
- IEEE Electron Device Letters
DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN
- - Minhaz Abedin
  - Shahrukh Khan
  - et al.
- 2024
- ASMC 2024
A novel integration scheme for self-aligend Ru topvia as post-Cu alternative metal interconnects
- - K. Motoyama
  - D. Metzler
  - et al.
- 2023
- IITC/MAM 2023
Methodology Development to Benchmark Power Delivery Designs in Advanced Technology Nodes
- - Nicholas A. Lanzillo
  - A. Chu
  - et al.
- 2023
- SPIE Advanced Lithography + Patterning 2023
Capacitive Impacts of Etch-Induced Dielectric Damage in Highly-Scaled Interconnect Architectures
- - Janet M. Wilson
  - Nicholas A. Lanzillo
- 2022
- IITC 2022