Reliability and resistance projections for rhodium and iridium interconnects from first-principles
- Nicholas A. Lanzillo
- Daniel C. Edelstein
- 2022
- Journal of Vacuum Science and Technology B
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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56 results for Nick Lanzillo
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials
Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA
First-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects
- Timothy M. Philip
- Nicholas A. Lanzillo
- et al.
- 2020
- Physical Review Applied
Structural and transport properties of Cu/Ta(N)/Cu interfaces in vertical interconnects
- Nicholas A. Lanzillo
- Lawrence Clevenger
- et al.
- 2020
- Journal of Applied Physics
Spin-dependent electron scattering in cobalt interconnects
- Nicholas A. Lanzillo
- P. Bhosale
- et al.
- 2019
- Journal of Physics D: Applied Physics
Electron Transport Across Cu/Ta(O)/Ru(O)/Cu Interfaces in Advanced Vertical Interconnects
- Nicholas A. Lanzillo
- Benjamin D. Briggs
- et al.
- 2019
- Computational Materials Science