Topological Semimetal Resistivity Scaling for Vertical Interconnect Applications
- Nick Lanzillo
- Utkarsh Bajpai
- et al.
- 2024
- Applied Physics Letters
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Thermal and Electrical Conductivity of Copper-Graphene Heterosystem: An Effect of Strain and Thickness
- Aiswarya Samal
- Anoop Kumar Kushwaha
- et al.
- 2023
- Advanced Engineering Materials
A Multiscale Simulation Study of the Structural Integrity of Damascene Interconnects in Advanced Technology Nodes
- Sagarika Mukesh
- Nicholas A. Lanzillo
- 2023
- IEEE T-ED
Size-Dependent Grain-Boundary Scattering in Topological Semimetals
- Nicholas A. Lanzillo
- Utkarsh Bajpai
- et al.
- 2022
- Physical Review Applied
Reliability and resistance projections for rhodium and iridium interconnects from first-principles
- Nicholas A. Lanzillo
- Daniel C. Edelstein
- 2022
- Journal of Vacuum Science and Technology B
Area-Selective Deposition of Tantalum Nitride with Polymerizable Monolayers: From Liquid to Vapor Phase Inhibitors
- Krystelle Lionti
- Noel Arellano
- et al.
- 2022
- Chemistry of Materials
Benchmarking Power Delivery Network Designs at the 5-nm Technology Node
- Nicholas A. Lanzillo
- Albert M. Chu
- et al.
- 2021
- IEEE T-ED
Power Delivery Design, Signal Routing, and Performance of On-Chip Cobalt Interconnects in Advanced Technology Nodes
- Nicholas A. Lanzillo
- Albert Chu
- et al.
- 2021
- IEEE Transactions on VLSI Systems
Additive Lithography - Organic Monolayer Patterning Coupled with an Area-Selective Deposition
- Rudy Wojtecki
- Jonathan Ma
- et al.
- 2021
- ACS AMI
Role of high aspect-ratio thin-film metal deposition in Cu back-end-of-line technology
- Andrew Simon
- O. Van Der Straten
- et al.
- 2020
- JVSTA