Enhanced electromigration resistance through grain size modulation in copper interconnects
- C. C. Yang
- Baozhen Li
- et al.
- 2015
- CSTIC 2015
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143 results for Daniel Edelstein
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
Sequential lateral solidification of silicon thin films on low-k dielectrics for low temperature integration
- Fabio Carta
- Stephen M. Gates
- et al.
- 2014
- Applied Physics Letters
Copper-to-dielectric heterogeneous bonding for 3D integration
- Wei Lin
- Juntao Li
- et al.
- 2014
- LTB-3D 2014
TDDB at low voltages: An electrochemical perspective
- Ramachandran Muralidhar
- Thomas M. Shaw
- et al.
- 2014
- IRPS 2014
Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability
- Takeshi Nogami
- M. Chae
- et al.
- 2014
- IITC/AMC 2014
Thermal stress control in Cu interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IITC/AMC 2014
Advanced metal and dielectric barrier cap films for Cu low k interconnects
- Deepika Priyadarshini
- Son Nguyen
- et al.
- 2014
- IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014
Microstructure modulation in copper interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IEEE Electron Device Letters