Publications

198 results for Christian Lavoie

Ni-Pt silicide formation through Ti mediating layers
- - Paul Besser
  - Christian Lavoie
  - et al.
- 2007
- Microelectronic Engineering
Transient and end silicide phase formation in thin film Ni/polycrystalline-Si reactions for fully silicided gate applications
- - J.A. Kittl
  - M.A. Pawlak
  - et al.
- 2007
- Applied Physics Letters
Implementation of robust nickel alloy salicide process for high-performance 65nm SOI CMOS manufacturing
- - Jay Strane
  - David Brown
  - et al.
- 2007
- VLSI-TSA 2007
Thin film solid-state reactions forming carbides as contact materials for carbon-containing semiconductors
- - W.P. Leroy
  - C. Detavernier
  - et al.
- 2007
- Journal of Applied Physics
Formation and morphological stability of NiSi in the presence of W, Ti, and Ta alloying elements
- - D. Deduytsche
  - C. Detavernier
  - et al.
- 2007
- Journal of Applied Physics
Influence of Ge substrate crystallinity on Co germanide formation in solid-state reactions
- - K. Opsomer
  - D. Deduytsche
  - et al.
- 2007
- Applied Physics Letters
Physical, electrical, and reliability characterization of Ru for Cu interconnects
- - C.-C. Yang
  - T. Spooner
  - et al.
- 2006
- IITC 2006
Thermal stress evaluation of a PCRAM material Ge₂Sb ₂Te₅
- - K.N. Chen
  - L. Krusin-Elbaum
  - et al.
- 2006
- NVSMW 2006
Effects of additive elements on the phase formation and morphological stability of nickel monosilicide films
- - C. Lavoie
  - C. Detavernier
  - et al.
- 2006
- Microelectronic Engineering
Influence of alloying elements on the formation and stability of NiSi
- - C. Detavernier
  - D. Deduytsche
  - et al.
- 2006
- ECS Meeting 2006