Mechanisms for enhanced formation of the C54 phase of titanium silicide ultra-large-scale integration contacts
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 2000
- Annual Review of Materials Science
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194 results for Christian Lavoie
Microstructural analysis of copper interconnections using picosecond ultrasonics
- James M.E. Harper
- Sandra G. Malhotra
- et al.
- 2000
- Materials Research Society Symposium-Proceedings
Thermal stability and oxygen-loss characteristics of Pt(O) films prepared by reactive sputtering
- K.L. Saenger
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics
Phase formation and resistivity in the ternary system Ti-Nb-Si
- Aliette Mouroux
- Marylène Roux
- et al.
- 1999
- Journal of Applied Physics
Mechanisms for enhanced C54-TiSi2 formation in Ti-Ta alloy films on single-crystal Si
- A. Quintero
- M. Libera
- et al.
- 1999
- Journal of Materials Research
In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere
- S.-L. Zhang
- C. Lavoie
- et al.
- 1999
- Journal of Applied Physics
Evidence of a two-stage reaction mechanism in sputter deposited Nb/Al multilayer thin-films studied by in situ synchrotron X-ray diffraction
- G.A. Lucadamo
- K. Barmak
- et al.
- 1999
- Materials Letters
Interdiffusion studies of single crystal TiN/NbN superlattice thin films
- C. Engström
- J. Birch
- et al.
- 1999
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Enhanced thermal stability of C49 TiSi2 in the presence of aluminum
- S.-L. Zhang
- F.M. D'Heurle
- et al.
- 1998
- Applied Physics Letters
Low temperature formation of C54-TiSi2 using titanium alloys
- C. Cabral Jr.
- L. Clevenger
- et al.
- 1997
- Applied Physics Letters