Publications

This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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49 results for E. Huang

Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- - Benjamin D. Briggs
  - C.B. Peethala
  - et al.
- 2017
- IEDM 2017
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- - Takeshi Nogami
  - Benjamin D. Briggs
  - et al.
- 2015
- IEDM 2015
Novel approach to functionalized nanoparticles: Self-crosslinking of macromolecules in ultradilute solution
- - David Mecerreyes
  - Victor Lee
  - et al.
- 2001
- Advanced Materials
Nanoscopic templates from oriented block copolymer films
- - Thomas Thurn-Albrecht
  - Rachel Steiner
  - et al.
- 2000
- Advanced Materials
Controlling polymer-surface interactions with random copolymer brushes
- - P. Mansky
  - Y. Liu
  - et al.
- 1997
- Science
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- - Benjamin D. Briggs
  - C.B. Pcethala
  - et al.
- 2018
- IITC 2018
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- - C. J. Penny
  - S. Gates
  - et al.
- 2017
- IITC 2017
Resistance contributions to copper interconnects
- - C. Witt
  - F. Baumann
  - et al.
- 2017
- IITC 2017
Experimental study of nanoscale Co damascene BEOL interconnect structures
- - James Kelly
  - James H.-C. Chen
  - et al.
- 2016
- IITC/AMC 2016
Post porosity plasma protection integration at 48 nm pitch
- - H. Huang
  - Krystelle Lionti
  - et al.
- 2016
- IITC/AMC 2016