Fully aligned via integration for extendibility of interconnects to beyond the 7 nm node
- Benjamin D. Briggs
- C.B. Peethala
- et al.
- 2017
- IEDM 2017
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49 results for E. Huang
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
Novel approach to functionalized nanoparticles: Self-crosslinking of macromolecules in ultradilute solution
- David Mecerreyes
- Victor Lee
- et al.
- 2001
- Advanced Materials
Nanoscopic templates from oriented block copolymer films
- Thomas Thurn-Albrecht
- Rachel Steiner
- et al.
- 2000
- Advanced Materials
Controlling polymer-surface interactions with random copolymer brushes
- P. Mansky
- Y. Liu
- et al.
- 1997
- Science
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Reliable airgap BEOL technology in advanced 48 nm pitch copper/ULK interconnects for substantial power and performance benefits
- C. J. Penny
- S. Gates
- et al.
- 2017
- IITC 2017
Resistance contributions to copper interconnects
- C. Witt
- F. Baumann
- et al.
- 2017
- IITC 2017
Experimental study of nanoscale Co damascene BEOL interconnect structures
- James Kelly
- James H.-C. Chen
- et al.
- 2016
- IITC/AMC 2016
Post porosity plasma protection integration at 48 nm pitch
- H. Huang
- Krystelle Lionti
- et al.
- 2016
- IITC/AMC 2016