Microfluidic Interposer for High Performance Fluidic Chip Cooling
- Wolfram Steller
- Frank Windrich
- et al.
- 2018
- ESTC 2018
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37 results for Gerd Schlottig
Dual-Side Heat Removal by Silicon Cold Plate and Interposer with Embedded Fluid Channels
- Thomas Brunschwiler
- Wolfram Steller
- et al.
- 2018
- ITherm 2018
Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill
- Rahel Straessle
- Severin Zimmermann
- et al.
- 2018
- IEEE Transactions on CPMT
Towards cube-sized compute nodes: Advanced packaging concepts enabling extreme 3D integration
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- IEDM 2017
Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
- Roman Stadler
- Luca Del Carro
- et al.
- 2017
- ITherm 2017
Thermal performance of a silicon-interposer with embedded fluid channels enabling dual-side heat removal
- Ozgur Ozsun
- Stephan Paredes
- et al.
- 2017
- ITherm 2017
Scalable packaging platform supporting high-performance 3D chip stacks
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2017
- Pan Pacific 2017
Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
- Thomas Brunschwiler
- Raúl Mroßko
- et al.
- 2016
- ESTC 2016
Intra-stack sealing of tier interconnects using the interconnect alloy
- Jessica Kleff
- Gerd Schlottig
- et al.
- 2016
- ESTC 2016
Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
- Thomas Brunschwiler
- Jonas Zürcher
- et al.
- 2016
- ASME Journal of Electronic Packaging