LID-integral cold plate topology integration, performance, and reliability
- Gerd Schlottig
- Marco De Fazio
- et al.
- 2015
- InterPACK 2015
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37 results for Gerd Schlottig
Advances in percolated thermal underfill (PTU) simulations for 3D-integration
- Sridhar Kumar
- Uwe Zschenderlein
- et al.
- 2015
- EuroSimE 2015
Energy efficient hotspot-targeted embedded liquid cooling of electronics
- Chander Shekhar Sharma
- Manish K. Tiwari
- et al.
- 2015
- Applied Energy
Thermal characterization of percolating thermal underfills: Bulk and cavity
- Brian R. Burg
- Manuel Koilly
- et al.
- 2014
- THERMINIC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
- Thomas Brunschwiler
- Ralph Heller
- et al.
- 2014
- ESTC 2014
Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
- Thomas Brunschwiler
- Timo Tick
- et al.
- 2014
- ESTC 2014
Wafer-level integration of embedded cooling approaches
- Stephan Paredes
- Yassir Madhour
- et al.
- 2014
- ISSWB 2014
Study of the compound of properties of percolating and neck-based thermal underfills
- Thomas Brunschwiler
- Florian Schindler-Saefkow
- et al.
- 2014
- ITherm 2014
Thermo-mechanical properties of underfills at partial and full filler percolation - Sub-layering the underfill
- Gerd Schlottig
- Marie Haupt
- et al.
- 2014
- EuroSimE 2014
Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
- Gerd Schlottig
- Florian Schindler-Saefkow
- et al.
- 2013
- EPTC 2013