Analysis and evaluation methods associated with the application of compliant thermal interface materials in multi-chip electronic board assemblies
- John Torok
- Shawn Canfield
- et al.
- 2011
- SEM Annual Conference on Experimental and Applied Mechanics 2011
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41 results for Michael Gaynes
Using in situ capacitance measurements to monitor the stability of thermal interface materials in complex PCB assemblies
- Michael Gaynes
- Timothy Chainer
- et al.
- 2010
- IMAPS 2010
Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- Jiantao Zheng
- Virendra Jadhav
- et al.
- 2009
- ECTC 2009
The over-bump applied resin wafer-level underfill process: Process, material and reliability
- Claudius Feger
- Nancy LaBianca
- et al.
- 2009
- ECTC 2009
A practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
High performance and subambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- Journal of Heat Transfer
High performance and sub-ambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- ICNMM 2006
Silicon microchannel cooling for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2006
- HVAC and R Research
A practical implementation of silicon microchannel coolers for high power chips
- E.G. Colgan
- B.K. Furman
- et al.
- 2005
- SEMI-THERM 2005
Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev