Claudius Feger, Nancy LaBianca, et al.
ECTC 2009
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35 kPa. Further, cooling of a thermal test chip with a micro channel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm2. Coolers of this design should be able to cool chips with average power densities of 400 W/cm2 or more. © 2007 IEEE.
Claudius Feger, Nancy LaBianca, et al.
ECTC 2009
Mark D. Schultz, Fanghao Yang, et al.
ASME Journal of Electronic Packaging
Christos D. Dimitrakopoulos, Ali Afzali-Ardakani, et al.
Synthetic Metals
Guy Cohen, Lei Shan, et al.
ECTC 2004