Introduction of pre-etch deposition techniques in EUV patterning
- Xun Xiang
- Genevieve Beique
- et al.
- 2018
- SPIE Advanced Lithography 2018
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28 results for Catherine Labelle
A comparative study of strain and Ge content in Si1-xGex channel using planar FETs, FinFETs, and strained relaxed buffer layer FinFETs
- Choonghyun Lee
- Shogo Mochizuki
- et al.
- 2017
- IEDM 2017
Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
- N. Loubet
- T.B. Hook
- et al.
- 2017
- VLSI Technology 2017
Methods to lower the resistivity of ruthenium interconnects at 7 nm node and beyond
- Xunyuan Zhang
- Huai Huang
- et al.
- 2017
- IITC 2017
Middle of line RC performance study at the 7 nm node
- Susan Su Chen Fan
- James H.-C. Chen
- et al.
- 2017
- IITC 2017
CMP: Consideration of stop-on selectivity in advanced node semiconductor manufacturing technology
- Stan Tsai
- Hari Amanapu
- et al.
- 2017
- ECS Meeting 2017 - New Orleans
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels
- Ruilong Xie
- Pietro Montanini
- et al.
- 2016
- IEDM 2016
CMP Challenges for Advanced Technology Nodes
- John H Zhang
- Haigou Huang
- et al.
- 2017
- MRS Advances
Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures
- B. Peethala
- F. Mont
- et al.
- 2016
- Microelectronic Engineering
Tungsten and cobalt metallization: A material study for MOL local interconnects
- Vimal Kamineni
- Mark Raymond
- et al.
- 2016
- IITC/AMC 2016