Fundamental limitations of existing models and future solutions for dielectric reliability and RRAM applications (invited)
- Ernest Y. Wu
- Andrew Kim
- et al.
- 2017
- IEDM 2017
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148 results for Thomas M. Shaw
Through-Cobalt Self Forming Barrier (tCoSFB) for Cu/ULK BEOL: A novel concept for advanced technology nodes
- Takeshi Nogami
- Benjamin D. Briggs
- et al.
- 2015
- IEDM 2015
Performance and reliability of thick Cu interconnects for RF and analog/mixed signal technology
- E. Cooney
- Jeff Gambino
- et al.
- 2013
- MRS Spring Meeting 2013
Reliability and structural design of a wafer-level 3D integration scheme with W TSVs based on Cu-oxide hybrid wafer bonding
- K.N. Chen
- T.M. Shaw
- et al.
- 2010
- IEDM 2010
A 45 nm CMOS node Cu/low-k/ ULtra low-k PECVD SiCOH (k=2.4) BEOL technology
- S. Sankaran
- S. Arai
- et al.
- 2006
- IEDM 2006
Stability and oxidation behavior of Ir thin film electrodes on Si and SiO2
- K.L. Saenger
- A. Grill
- et al.
- 1998
- MRS Fall Meeting 1998
Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
Characterization of "ultrathin-Cu"/Ru(Ta)/TaN liner stack for copper interconnects
- C.-C. Yang
- S. Cohen
- et al.
- 2010
- IEEE Electron Device Letters
Nonlinear dielectric relaxation of Mn doped polycrystalline (Ba,Sr)TiO3 thin films over the temperature range of 4.2 - 473 K
- J.D. Baniecki
- R.B. Laibowitz
- et al.
- 1998
- MRS Fall Meeting 1998
Pairing Symmetry and Flux Quantization in a Tricrystal Superconducting Ring of YBa2Cu3O7-δ
- C.C. Tsuei
- J.R. Kirtley
- et al.
- 1994
- Physical Review Letters