Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects
- Deepika Priyadarshini
- Son Van Nguyen
- et al.
- 2016
- IITC/AMC 2016
Publications
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148 results for Thomas M. Shaw
The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015
Spatial mapping of non-uniform time-to-breakdown and physical evidence of defect clustering
- Ernest Y. Wu
- Baozhen Li
- et al.
- 2014
- VLSI Technology 2014
TDDB at low voltages: An electrochemical perspective
- Ramachandran Muralidhar
- Thomas M. Shaw
- et al.
- 2014
- IRPS 2014
Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability
- Takeshi Nogami
- M. Chae
- et al.
- 2014
- IITC/AMC 2014
Advanced metal and dielectric barrier cap films for Cu low k interconnects
- Deepika Priyadarshini
- Son Nguyen
- et al.
- 2014
- IITC/AMC 2014
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014
The PiezoElectronic switch: A path to low energy electronics
- Paul Solomon
- Brian A. Bryce
- et al.
- 2013
- E3S 2013
A novel integrated reliability test system for BEOL TDDB study
- Jifeng Chen
- Peilin Song
- et al.
- 2012
- ISTFA 2012
Tailoring dielectric materials for robust BEOL reliability
- G. Bonilla
- T.M. Shaw
- et al.
- 2012
- IRPS 2012