UV Assisted Densification of PerHydroPoIySilazane (PHPS) based Spin-On glass in High Aspect Ratio Gap Fill Structure
- S. Mehta
- H. Sheng
- et al.
- 2018
- ECS Meeting 2018
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16 results for S. Grunow
An Analytical Metal Resistance Model and Its Application for Sub-22-nm Metal-Gate CMOS
- X. Miao
- Ruqiang Bao
- et al.
- 2015
- IEEE Electron Device Letters
Replacement metal gate resistance in FinFET architecture modelling, validation and extendibility
- Ruqiang Bao
- Brian Greene
- et al.
- 2015
- IEDM 2015
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
Reducing density-induced CMP non-uniformity for advanced semiconductor technology nodes
- John H. Zhang
- Wei-Tsu Tseng
- et al.
- 2013
- MRS Spring Meeting 2013
Optimization of Cu damascene electrodeposition process in ULSI for yield and reliability improvement
- Ingrid Shao
- T. Cheng
- et al.
- 2013
- ECS Transactions
Formation mechanism and suppression methods of copper dendrites in BEOL integration
- Shaoning Yao
- Wei-Tsu Tseng
- et al.
- 2011
- ADMETA 2011
UV curing-induced photoresist poisoning in advanced ULK BEOL integration schemes
- Y.C. Ee
- D. Kioussis
- et al.
- 2009
- ADMETA 2009
CoWP metal caps for reliable 32 nm 1X Cu interconnects in porous ULK (k=2.4)
- E. Huang
- M. Oh
- et al.
- 2009
- ADMETA 2009