Silicon photonics and challenges for fabrication
- N. Feilchenfeld
- Karen Nummy
- et al.
- 2017
- SPIE Advanced Lithography 2017
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19 results for Karen Nummy
0.026μm2 high performance Embedded DRAM in 22nm technology for server and SOC applications
- C. Pei
- G. Wang
- et al.
- 2014
- IEDM 2014
Challenges of nickel silicidation in CMOS technologies
- Nicolas Breil
- Christian Lavoie
- et al.
- 2015
- Microelectronic Engineering
22nm technology yield optimization using multivariate 3D virtual fabrication
- B. Cipriany
- B. Jagannathan
- et al.
- 2013
- SISPAD 2013
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
- S. Narasimha
- P. Chang
- et al.
- 2012
- IEDM 2012
Scaling deep trench based eDRAM on SOI to 32nm and beyond
- G. Wang
- D. Anand
- et al.
- 2009
- IEDM 2009
(110) Channel, SiON gate-dielectric PMOS with record high Ion=1 mA/μm through channel stress and source drain external resistance (R ext) engineering
- B. Yang
- A. Waite
- et al.
- 2007
- IEDM 2007
CMOS fabricated by hybrid-orientation technology (HOT)
- Bin Yang
- M. Yang
- et al.
- 2007
- IEDST 2007
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006