Ionized magnetron sputtering for lining and filling trenches and vias
- S.M. Rossnagel
- 1996
- Semiconductor International
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97 results for Stephen Rossnagel
Thin, high atomic weight refractory film deposition for diffusion barrier, adhesion layer, and seed layer applications
- S.M. Rossnagel
- C. Nichols
- et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Ionized physical vapor deposition of Cu for high aspect ratio damascene trench fill applications
- C. Nichols
- S.M. Rossnagel
- et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Cu metallization using a permanent magnet electron cyclotron resonance microwave plasma/sputtering hybrid system
- S.M. Gorbatkin
- D.B. Poker
- et al.
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Development of 111 texture in Al films grown on SiO2/Si(001) by ultrahigh-vacuum primary-ion deposition
- Y.W. Kim
- I. Petrov
- et al.
- 1996
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Liner conformality in ionized magnetron sputter metal deposition processes
- S. Hamaguchi
- S.M. Rossnagel
- 1996
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Directional sputter deposition for semiconductor applications
- S.M. Rossnagel
- 1994
- MRS Fall Meeting 1994
Directional and preferential sputtering-based physical vapor deposition
- S.M. Rossnagel
- 1995
- Thin Solid Films
Surface-topography simulations of ionized sputter metal deposition
- S. Hamaguchi
- S.M. Rossnagel
- 1995
- MRS Spring Meeting 1995
Simulations of trench-filling profiles under ionized magnetron sputter metal deposition
- S. Hamaguchi
- S.M. Rossnagel
- 1995
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures