DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
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57 results for Matthew Colburn
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
Plasma etch patterning of EUV lithography: Balancing roughness and selectivity trade off
- Sebastian U. Engelmann
- Qinghuang Lin
- et al.
- 2016
- SPIE Advanced Lithography 2016
Thermomechanical behavior of EUV pellicle under dynamic exposure conditions
- Dario Goldfarb
- Max O. Bloomfield
- et al.
- 2016
- SPIE Advanced Lithography 2016
High chi block copolymer DSA to improve pattern quality for FinFET device fabrication
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2016
- SPIE Advanced Lithography 2016
Comparison of left and right side line edge roughness in lithography
- Lei Sun
- Nicole Saulnier
- et al.
- 2016
- SPIE Advanced Lithography 2016
Fin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015
Self-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch
- Hsinyu Tsai
- Hiroyuki Miyazoe
- et al.
- 2015
- SPIE Advanced Lithography 2015
Towards production ready processing with a state-of-the-art EUV cluster
- Karen Petrillo
- Nicole Saulnier
- et al.
- 2015
- SPIE Advanced Lithography 2015
EUV processing and characterization for BEOL
- Nicole Saulnier
- Yongan Xu
- et al.
- 2015
- SPIE Advanced Lithography 2015