22 nm technology compatible fully functional 0.1 μm 2 6T-sram cell
- B. Haran
- A. Kumar
- et al.
- 2008
- IEDM 2008
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18 results for Chiew-Seng Koay
Reaching for the true overlay in advanced nodes
- Chiew-Seng Koay
- Bassem Hamieh
- et al.
- 2017
- SPIE Advanced Lithography 2017
Assessments of image-based and scatterometry-based overlay targets
- Chiew-Seng Koay
- Nelson Felix
- et al.
- 2016
- SPIE Advanced Lithography 2016
Towards production ready processing with a state-of-the-art EUV cluster
- Karen Petrillo
- Nicole Saulnier
- et al.
- 2015
- SPIE Advanced Lithography 2015
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
- Shyng-Tsong Chen
- Hideyuki Tomizawa
- et al.
- 2011
- IITC/MAM 2011
Optimization of pitch-split double patterning phoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- ASMC 2011
Spacer-defined double patterning for 20-nm and beyond logic BEOL technology
- Ryoung-Han Kim
- Chiew-Seng Koay
- et al.
- 2011
- SPIE Advanced Lithography 2011
Overlay improvement roadmap: Strategies for scanner control and product disposition for 5-nm overlay
- 2011
- SPIE Advanced Lithography 2011
Optimization of pitch-split double patterning photoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- SPIE Advanced Lithography 2011