Vertical-Transport Nanosheet Technology for CMOS Scaling beyond Lateral-Transport Devices
- H. Jagannathan
- B. Anderson
- et al.
- 2021
- IEDM 2021
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25 results for R. R. Robison
Full Bottom Dielectric Isolation to Enable Stacked Nanosheet Transistor for Low Power and High Performance Applications
- J. Zhang
- S. Pancharatnam
- et al.
- 2019
- IEDM 2019
Channel Geometry Impact and Narrow Sheet Effect of Stacked Nanosheet
- Chun Wing Yeung
- Jingyun Zhang
- et al.
- 2018
- IEDM 2018
Technology viable DC performance elements for Si/SiGe channel CMOS FinFTT
- G. Tsutsui
- Ruqiang Bao
- et al.
- 2016
- IEDM 2016
High performance 14nm SOI FinFET CMOS technology with 0.0174μm2 embedded DRAM and 15 levels of Cu metallization
- C.-H.C-H. Lin
- Brian Greene
- et al.
- 2014
- IEDM 2014
2nd Generation dual-channel optimization with cSiGe for 22nm HP technology and beyond
- C. Ortolland
- Daniel Jaeger
- et al.
- 2013
- IEDM 2013
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
- S. Narasimha
- P. Chang
- et al.
- 2012
- IEDM 2012
Resistive Memory Process Optimization for High Resistance Switching Toward Scalable Analog Compute Technology for Deep Learning
- Youngseok Kim
- Soon-Cheon Seo
- et al.
- 2021
- IEEE Electron Device Letters
Bottom electrode properties and electrical field cycling effects on hfox based resistive switching memory device
- J. Li
- Youngseok Kim
- et al.
- 2020
- ISTFA 2020
A Materials Screening Methodology for Scaled Non-Volatile Memory in the AI Era
- Nicholas A. Lanzillo
- R. R. Robison
- 2019
- ANTS 2019