Validation and application of physics-based via models to dense via arrays
- Xiaoxiong Gu
- Young Kwark
- et al.
- 2011
- DesignCon 2011
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54 results for Christian Schuster
Impact of multiple scattering on passivity of equivalent-circuit via models
- Xiaomin Duan
- Renato Rimolo-Donadio
- et al.
- 2011
- EDAPS 2011
Novel multiport probing fixture for high frequency measurements in dense via arrays
- Young H. Kwark
- Miroslav Kotzev
- et al.
- 2011
- IMS 2011
Electrical performance of a multiport interposer for measurements of dense via arrays
- Miroslav Kotzev
- Young H. Kwark
- et al.
- 2011
- IEEE-SPI 2011
Fast physics-based via and trace models for signal and power integrity co-analysis
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2010
- DesignCon 2010
Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects
- Xiaoxiong Gu
- Francesco De Paulis
- et al.
- 2009
- DesignCon 2009
Bandwidth study of recessed probe launch variations for broadband measurement of embedded PCB structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2009
- GeMIC 2009
Eliminating via-plane coupling using ground vias for high-speed signal transitions
- Songping Wu
- Xin Chang
- et al.
- 2008
- EPEPS 2008
Analysis and optimization of the recessed probe launch for high frequency measurements of PCB interconnects
- Renato Rimolo-Donadio
- Christian Schuster
- et al.
- 2008
- DATE 2008
Developing a "physical" model for vias - Part II: Coupled and ground return vias
- Giuseppe Selli
- Christian Schuster
- et al.
- 2007
- DesignCon 2007