An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
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54 results for Christian Schuster
Using via stubs in periodic structures for microwave filter design
- Andreas Hardock
- Young H. Kwark
- et al.
- 2014
- IEEE Transactions on CPMT
Application of vias as functional elements in microwave coupling structures
- Andreas Hardock
- Renato Rimolo-Donadio
- et al.
- 2013
- IEEE T-MTT
Complete modeling of large via constellations in multilayer printed circuit boards
- Sebastian Müller
- Fabian Happ
- et al.
- 2013
- IEEE Transactions on CPMT
Accuracy of physics-based via models for simulation of dense via arrays
- Sebastian Müller
- Xiaomin Duan
- et al.
- 2012
- IEEE Trans Electromagn Compat
Electrical performance of the recessed probe launch technique for measurement of embedded multilayer structures
- Miroslav Kotzev
- Renato Rimolo-Donadio
- et al.
- 2012
- IEEE Trans. Instrum. Meas.
Is 25 Gb/s on-board signaling viable?
- Dong G. Kam
- Mark B. Ritter
- et al.
- 2009
- IEEE Transactions on Advanced Packaging
Physics-based via and trace models for efficient link simulation on multilayer structures up to 40 GHz
- Renato Rimolo-Donadio
- Xiaoxiong Gu
- et al.
- 2009
- IEEE T-MTT
Terabus: Terabit/second-class card-level optical interconnect technologies
- Laurent Schares
- Jeffrey A. Kash
- et al.
- 2006
- IEEE Journal on Selected Topics in Quantum Electronics
A recursive un-termination method for nondestructive in situ S-parameter measurement of hermetically encapsulated packages
- Ullrich R. Pfeiffer
- Christian Schuster
- 2005
- IEEE T-MTT