300 mm SGOI/strain-Si for high-performance CMOS
- A. Reznicek
- S.W. Bedell
- et al.
- 2004
- IEEE International SOI Conference 2004
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60 results for Keith Fogel
Observation of stacking faults in strained Si layers
- S.W. Bedell
- K.E. Fogel
- et al.
- 2004
- Applied Physics Letters
Quick turnaround technique for highlighting defects in thin Si/SiGe bilayers
- S.W. Bedell
- D.K. Sadana
- et al.
- 2004
- Electrochemical and Solid-State Letters
A survey of defects in strained Si layers
- S.W. Bedell
- H. Chen
- et al.
- 2004
- MRS Proceedings 2004
Interfacial reaction studies on lead (Pb)-free solder alloys
- Sung K. Kang
- D.Y. Shih
- et al.
- 2002
- IEEE Transactions on Electronics Packaging Manufacturing
Interfacial reaction studies on lead (Pb)-free solder alloys
- S.K. Kang
- D.Y. Shih
- et al.
- 2001
- ECTC 2001
Foamed elastomers for packaging interconnections, testing and burn-in applications
- Yun-Hsin Liao
- D.Y. Shih
- et al.
- 1996
- MRS Fall Meeting 1996
New ball grid array module test sockets
- D.Y. Shih
- Paul Lauro
- et al.
- 1996
- ECTC 1996
Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
Intra-system interconnects for digital communications
- A. Deutsch
- G. Arjavalingam
- et al.
- 1994
- ECTC 1994