Performance impact of through-silicon vias (TSVs) in three-dimensional technology measured by SRAM ring oscillators
- Jente B. Kuang
- Keith A. Jenkins
- et al.
- 2013
- ESSCIRC 2013
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.