End-to-end multicore multimode fiber optic link operating up to 120 Gb/s
- Benjamin G. Lee
- Daniel M. Kuchta
- et al.
- 2012
- Journal of Lightwave Technology
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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165 results for Clint L. Schow
Terabit/s-class optical PCB links incorporating 360-Gb/s bidirectional 850 nm parallel optical transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
Transmitter predistortion for simultaneous improvements in bit rate, sensitivity, jitter, and power efficiency in 20 Gb/s CMOS-Driven VCSEL links
- Alexander V. Rylyakov
- Clint L. Schow
- et al.
- 2012
- Journal of Lightwave Technology
30Gbit/s, 850nm, VCSEL-based optical link
- Clint L. Schow
- Alexander V. Rylyakov
- 2011
- Electronics Letters
Demonstration of a digital CMOS driver codesigned and integrated with a broadband silicon photonic switch
- Benjamin G. Lee
- Clint L. Schow
- et al.
- 2011
- Journal of Lightwave Technology
A 24-channel, 300 Gb/s, 8.2 pJ/bit, full-duplex fiber-coupled optical transceiver module based on a single "holey" CMOS IC
- Clint L. Schow
- Fuad E. Doany
- et al.
- 2011
- Journal of Lightwave Technology
Multichannel high-bandwidth coupling of ultradense silicon photonic waveguide array to standard-pitch fiber array
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2011
- Journal of Lightwave Technology
Non-blocking 4x4 electro-optic silicon switch for on-chip photonic networks
- Min Yang
- William M. J. Green
- et al.
- 2010
- Optics Express
CMOS-integrated optical receivers for on-chip interconnects
- Solomon Assefa
- Fengnian Xia
- et al.
- 2010
- IEEE Journal on Selected Topics in Quantum Electronics
160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-cased transceivers
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2009
- IEEE Transactions on Advanced Packaging