Alex Forencich, Valerija Kamchevska, et al.
OFC 2018
In the "Terabus" optical interconnect program, optical data bus technologies are developed that will support terabit/second chip-to-chip data transfers over organic cards within high-performance servers, switch routers, and other intensive computing systems. A complete technology set is developed for this purpose, based on a chip-like optoelectronic packaging structure (Optochip), assembled directly onto an organic card (Optocard). Vertical-cavity surface emitting laser (VCSEL) and photodiode arrays (4 × 12) are flip-chip bonded to the driver and receiver IC arrays implemented in 0.13-μm CMOS. The IC arrays are in turn flip-chip assembled onto a 1.2-cm 2 silicon carrier interposer to complete the transmitter and receiver Optochips. The organic Optocard incorporates 48 parallel multimode optical waveguides on a 62.5-μm pitch. A simple scheme for optical coupling between the Optochip and the Optocard is developed, based on a single-lens array etched onto the backside of the optoelectronic arrays and on 45° mirrors in the waveguides. Transmitter and receiver operation is demonstrated up to 20 and 14 Gb/s per channel, respectively. The power dissipation of 10-Gb/s single-channel links over multimode fiber is as low as 50 mW. © 2006 IEEE.
Alex Forencich, Valerija Kamchevska, et al.
OFC 2018
Daniel M. Kuchta, Clint Schow, et al.
OFC 2013
Benjamin G. Lee, Daniel M. Kuchta, et al.
Journal of Lightwave Technology
Hannah R. Grant, Alex Forencich, et al.
OI 2016