200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules
- C. Wang
- S.W. Nam
- et al.
- 2013
- IEDM 2013
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33 results for John M. Cotte
System-on-Package (SOP) technology, characterization and applications
- J. Knickerbocker
- P. Andry
- et al.
- 2006
- ECTC 2006
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Optimization of SiGe HBT Technology for High Speed Analog and Mixed-Signal Applications
- D.L. Harame
- J.M.C. Stork
- et al.
- 1993
- IEDM 1993
A high performance epitaxial SiGe-base ECL BiCMOS technology
- D.L. Harame
- E.F. Crabbe
- et al.
- 1992
- IEDM 1992
Wafer-scale integration of sacrificial nanofluidic chips for detecting and manipulating single DNA molecules
- Chao Wang
- Sung Wook Nam
- et al.
- 2017
- Nature Communications
Evaluation of emitter profiles and lateral uniformity on crystalline silicon photovoltaic cells using scanning capacitance microscopy
- Laura Kosbar
- Jochonia Nxumalo
- et al.
- 2010
- PVSC 2010
Measuring layer-specific depth-of-focus requirements
- Bernhard Liegl
- Allen Gabor
- et al.
- 2008
- SPIE Advanced Lithography 2008
High-efficiency 60 GHz antenna fabricated using low-cost silicon micromachining techniques
- N. Hoivik
- D. Liu
- et al.
- 2007
- APS 2007
An alternative low resistance MOL technology with electroplated rhodium as contact plugs for 32nm CMOS and beyond
- I. Shao
- J.M. Cotte
- et al.
- 2007
- IITC 2007