Evaluation of o2 plasma and xef2 vapor etch release processes for rf-mems switches fabricated using cmos interconnect technology
- Christopher V. Jahnes
- Nils Hoivik
- et al.
- 2006
- TRANSDUCERS 2006
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33 results for John M. Cotte
Analysis and modeling of curvature in copper-based mems structures fabricated using CMOS interconnect technology
- Marie-Ange Eyoum
- Nils Hoivik
- et al.
- 2005
- TRANSDUCERS 2005
Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods
- C.V. Jahnes
- J.M. Cotte
- et al.
- 2004
- MEMS 2004
Fabrication challenges for next-generation devices: Microelectromechanical systems for radio-frequency wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2003
- Journal of Microlithography, Microfabrication and Microsystems
Fabrication challenges for next generation devices: MEMS for RF wireless communications
- David Seeger
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE - The International Society for Optical Engineering
Pb-free solder alloys for flip chip applications
- S.K. Kang
- J. Horkans
- et al.
- 1999
- ECTC 1999
Subatmospheric chemical vapor deposition ozone/TEOS process for SiO2 trench filling
- I.A. Shareef
- G.W. Rubloff
- et al.
- 1995
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Optimization of SiGe HBT Technology for High Speed Analog and Mixed-Signal Applications
- D.L. Harame
- J.M.C. Stork
- et al.
- 1993
- IEDM 1993
Ge segregation in SiGe/Si heterostructures and its dependence on deposition technique and growth atmosphere
- D.A. Grützmacher
- T.O. Sedgwick
- et al.
- 1993
- Applied Physics Letters
Diffusion of elements implanted in amorphous titanium disilicide
- F.M. d'Heurle
- J.M. Cotte
- et al.
- 1993
- Applied Surface Science