200 mm wafer-scale integration of sub-20 nm sacrificial nanofluidic channels for manipulating and imaging single DNA molecules
- C. Wang
- S.W. Nam
- et al.
- 2013
- IEDM 2013
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91 results for Christopher V. Jahnes
High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Terabit/sec 48-channel fiber-coupled optical module based on holey CMOS transceiver IC
- Fuad E. Doany
- Benjamin G. Lee
- et al.
- 2012
- ECTC 2012
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
A 3.9ns 8.9mW 4x4 silicon photonic switch hybrid integrated with CMOS driver
- Alexander Rylyakov
- Clint Schow
- et al.
- 2011
- ISSCC 2011
Dense 24 TX + 24 RX fiber-coupled optical module based on a holey CMOS transceiver IC
- Fuad E. Doany
- Clint L. Schow
- et al.
- 2010
- ECTC 2010
Integration issues for diamond like carbon in a copper damascene process flow
- A. Grill
- C.V. Jahnes
- et al.
- 1998
- MRS Spring Meeting 1998
Monolithic Spiral Inductors Fabricated Using a VLSI Cu-Damascene Interconnect Technology and Low-Loss Substrates
- J.N. Burghartz
- D. Edelstein
- et al.
- 1996
- IEDM 1996
Diamondlike carbon materials as low-k dielectrics for multilevel interconnects in ULSI
- A. Grill
- V.V. Patel
- et al.
- 1996
- MRS Fall Meeting 1996
Polymer/metal composite for interconnection technology
- Ravi F. Saraf
- Judith Roldan
- et al.
- 1995
- ECTC 1995