EUV photomask defects: What prints, what doesn't, and what is required for HVM
- Jed Rankin
- Zhengqing John Qi
- et al.
- 2015
- SPIE Photomask Technology + EUV Lithography 2015
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49 results for Scott D. Halle
Toward defect guard-banding of EUV exposures by full chip optical wafer inspection of EUV mask defect adders
- Scott D. Halle
- Luciana Meli
- et al.
- 2015
- SPIE Advanced Lithography 2015
Methodology for determining CD-SEM measurement condition of sub-20nm resist patterns for 0.33NA EUV lithography
- Nobuhiro Okai
- Erin Lavigne
- et al.
- 2015
- SPIE Advanced Lithography 2015
E-beam inspection of EUV mask defects: To etch or not to etch?
- Ravi Bonam
- Hung-Yu Tien
- et al.
- 2014
- SPIE Advanced Lithography 2014
Precise CD-SEM metrology of resist patterns at around 20 nm for 0.33NA EUV lithography
- Nobuhiro Okai
- Erin Lavigne
- et al.
- 2014
- SPIE Advanced Lithography 2014
E-beam inspection of EUV programmed defect wafers for printability analysis
- Ravi Bonam
- Scott Halle
- et al.
- 2013
- ASMC 2013
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
- James Hsueh-Chung Chen
- Christopher Waskiewicz
- et al.
- 2012
- IITC 2012
Lens heating challenges for negative tone develop layers with freeform illumination: A comparative study of experimental vs. simulated results
- Scott Halle
- Michael Crouse
- et al.
- 2012
- SPIE Advanced Lithography 2012
Dose-focus monitor technique using CD-SEM and application to local variation analysis
- Shoji Hotta
- Timothy Brunner
- et al.
- 2012
- SPIE Advanced Lithography 2012
Dose-focus monitor technique using a critical-dimension scanning electron microscope and its application to local variation analysis
- Shoji Hotta
- Timothy Brunner
- et al.
- 2012
- J. Micro/Nanolithogr. MEMS MOEMS