No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
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34 results for Kang-Wook Lee
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
Adhesion test standardization for multichip module packages
- D.Y. Shih
- J. Kim
- et al.
- 1995
- ECTC 1995
Effects of polyimide surface structure on liquid crystal alignment
- K.-W. Lee
- S.A. Lien
- et al.
- 1995
- SPE ANTEC 1995
Organic passivation of copper for MCM-D packaging
- K.-W. Lee
- G.F. Walker
- et al.
- 1994
- International SAMPE Electronics Conference 1994
Surface modification of low CTE polyimide
- K.-W. Lee
- S.P. Kowalczyk
- et al.
- 1991
- ANTEC Annual Technical Conference 1991
Polyimide surface chemistry
- K.-W. Lee
- S.P. Kowalczyk
- et al.
- 1989
- ACS PMSE 1989
Polyimide surface chemistry
- K.-W. Lee
- S.P. Kowalczyk
- et al.
- 1989
- ACS National Meeting 1989
Plasma treatment effect on polymer buried interfacial structure and property
- Nathan W. Ulrich
- John Andre
- et al.
- 2017
- Physical Chemistry Chemical Physics
Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis
- John N. Myers
- Xiaoxian Zhang
- et al.
- 2015
- IEEE Transactions on CPMT