Plasma treatment effect on polymer buried interfacial structure and property
- Nathan W. Ulrich
- John Andre
- et al.
- 2017
- Physical Chemistry Chemical Physics
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34 results for Kang-Wook Lee
Nondestructive Characterization of Molecular Structures at Buried Copper/Epoxy Interfaces and Their Relationship to Locus of Failure Analysis
- John N. Myers
- Xiaoxian Zhang
- et al.
- 2015
- IEEE Transactions on CPMT
Hygrothermal aging effects on buried molecular structures at epoxy interfaces
- John N. Myers
- Chi Zhang
- et al.
- 2013
- Langmuir
Electrochemical reactions in solder mask of flip chip-plastic ball grid array package
- Kang-Wook Lee
- Stephane Barbeau
- et al.
- 2013
- ECTC 2013
No Clean Flux technology for large die flip chip packages
- Akihiro Horibe
- Kang-Wook Lee
- et al.
- 2013
- ECTC 2013
Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
Structure-property relationships of hydrido organo siloxane polymer (HOSP)
- Ann R. Fornof
- Christy Tyberg
- et al.
- 2002
- Polymer Bulletin
Surface Modification of BPDA-PDA Polyimide
- Kang-Wook Lee
- Steven P. Kowalczyk
- et al.
- 2002
- Langmuir
Surface Modification of Pmda-Oda Polyimide: Surface Structure-Adhesion Relationship
- Kang-Wook Lee
- Steven P. Kowalczyk
- et al.
- 2002
- Macromolecules
Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin
- J. Yu
- M. Ree
- et al.
- 2000
- Macromolecular Chemistry and Physics