Hygrothermal aging effects on buried molecular structures at epoxy interfaces
- John N. Myers
- Chi Zhang
- et al.
- 2013
- Langmuir
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34 results for Kang-Wook Lee
Effects of mechanical stress and moisture on packaging interfaces
- Stephen L. Buchwalter
- Peter J. Brofman
- et al.
- 2005
- IBM J. Res. Dev
Structure-property relationships of hydrido organo siloxane polymer (HOSP)
- Ann R. Fornof
- Christy Tyberg
- et al.
- 2002
- Polymer Bulletin
Surface Modification of Pmda-Oda Polyimide: Surface Structure-Adhesion Relationship
- Kang-Wook Lee
- Steven P. Kowalczyk
- et al.
- 2002
- Macromolecules
Surface Modification of BPDA-PDA Polyimide
- Kang-Wook Lee
- Steven P. Kowalczyk
- et al.
- 2002
- Langmuir
Adhesion of poly(4,4′-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin
- J. Yu
- M. Ree
- et al.
- 2000
- Macromolecular Chemistry and Physics
Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper joints
- J. Yu
- M. Ree
- et al.
- 2000
- Polymer
Effect of the environment on the measured values of the adhesion of polyimide to silicon
- Sang-Hyon Paek
- Kang-Wook Lee
- et al.
- 1999
- Journal of Adhesion Science and Technology
Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: effect of precursor origin
- J. Yu
- M. Ree
- et al.
- 1999
- Journal of Polymer Science, Part B: Polymer Physics
A mechanistic picture of the effects of rubbing on polyimide surfaces and liquid crystal pretilt angles
- S.-H. Paek
- C.J. Durning
- et al.
- 1998
- Journal of Applied Physics