Single-step deep reactive ion etch of silicon for through-via applications with alternative gas mixtures
- Richa Agrawal
- Nathan Marchack
- et al.
- 2025
- Journal of Vacuum Science and Technology A Vacuum Surfaces and Films
Publications
47 results for S. Molis
Inhibitor-Free Area-Selective Deposition of Titanium Nitride
- Damon B. Farmer
- Marinus Hopstaken
- et al.
- 2025
- Chemistry of Materials
Etching of iridium thin films in chlorine- and fluorine-based inductively coupled plasmas
- Juliano Borges
- Hongwen Yan
- et al.
- 2024
- SPIE Advanced Lithography 2024
Characterization of TSV etch from a sustainability standpoint
- Osakpolo Isowamwen
- Nathan Marchack
- et al.
- 2023
- SPIE Advanced Lithography 2023
Hydrocarbon layer formation and removal studies on SiN films etched in halogen/hydrofluorocarbon plasmas
- L. Buzi
- J. M. Papalia
- et al.
- 2020
- SPIE Advanced Lithography 2020
Impact of HF-based cleaning solutions on via resistance for sub-10 nm BEOL structures
- B. Peethala
- F. Mont
- et al.
- 2016
- Microelectronic Engineering
Ultrathin (8-14 nm) conformal SiN for sub-20 nm Copper/Low-k Interconnects
- Son Van Nguyen
- Deepika Priyadarshini
- et al.
- 2014
- ECS Meeting 2014
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
Electromigration extendibility of Cu(Mn) alloy-seed interconnects, and understanding the fundamentals
- Takeshi Nogami
- C. Penny
- et al.
- 2012
- IEDM 2012