Driving down defect density in composite EUV patterning film stacks
- Luciana Meli
- Karen Petrillo
- et al.
- 2017
- SPIE Advanced Lithography 2017
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20 results for Dave Hetzer
DSA via hole shrink for advanced node applications
- Cheng Chi
- Chi Chun Liu
- et al.
- 2016
- SPIE Advanced Lithography 2016
DSA patterning options for FinFET formation at 7nm node
- Chi Chun Liu
- Elliott Franke
- et al.
- 2016
- SPIE Advanced Lithography 2016
EUV patterning successes and frontiers
- Nelson Felix
- Daniel Corliss
- et al.
- 2016
- SPIE Advanced Lithography 2016
Fin formation using graphoepitaxy DSA for FinFET device fabrication
- Chi Chun Liu
- Fee Li Lie
- et al.
- 2015
- SPIE Advanced Lithography 2015
Towards production ready processing with a state-of-the-art EUV cluster
- Karen Petrillo
- Nicole Saulnier
- et al.
- 2015
- SPIE Advanced Lithography 2015
Towards electrical testable soi devices using directed self-assembly for fin formation
- Chi Chun Liu
- Cristina Estrada-Raygoza
- et al.
- 2014
- SPIE Advanced Lithography 2014
Directed self-assembly process implementation in a 300mm pilot line environment
- Chi-Chun Liu
- I. Cristina Estrada-Raygoza
- et al.
- 2013
- SPIE Advanced Lithography 2013
Optimization of pitch-split double patterning phoresist for applications at the 16nm node
- Steven J. Holmes
- Cherry Tang
- et al.
- 2011
- ASMC 2011
Defect detection strategies and process partitioning for single-expose EUV patterning
- Luciana Meli
- Karen Petrillo
- et al.
- 2019
- J. Micro/Nanolithogr. MEMS MOEMS